The National Third Generation Semiconductor Technology Innovation Center is overall planned by the Ministry of Science and Technology. An equipment platform will be built in Changsha to gather domestic and foreign high-end talents in the field of third-generation semiconductor equipment.
Cooperation between enterprises, universities, research institutes and end-users will be conducted to tackle problems and carry out researches on key technologies and basic generic technologies. A series of new technologies, equipment, and products will be fostered. A creative chain that enables science to become technologies, technologies to produce products, and products to be developed into an industry will be formed.
Hunan's third-generation semiconductor industry has a solid foundation and has formed a significant industrial agglomeration. It is one of priorities of Hunan to build a technological innovation hub with core competitiveness. A complete equipment R&D and industrialization innovation system will be built in the center through the construction of a domestic core equipment technology research and development and pilot plant test platform. This will help promote the application and demonstration of domestic equipment, and boost upstream and downstream industries including equipment support, technical support, operation and maintenance, and upgrade services. A number of first-class equipment enterprises with core innovation ability will be fostered to support the high-quality development of Hunan’s third-generation semiconductor equipment industry and enhance the competitiveness of the sector.
This article is from Hunan Provincial Government www.enghunan.gov.cn.
Translator: Xiao Juan
Chinese source: Hunan Daily
